HOLMES: Hierarchical Optimization with poLygonal ModEling for Large-Scale AMS Placement
IEEE International Symposium on Circuits and Systems (ISCAS), Shanghai, China, May 24-27, 2026.
- † 通讯作者
- 已录用
工程博士生
CODA lab · 复旦大学
2024年秋季加入课题组
近期研究包括时序驱动布线与电路版图自动化。
与 Yumao Wu 教授联合指导
IEEE International Symposium on Circuits and Systems (ISCAS), Shanghai, China, May 24-27, 2026.
IEEE International Symposium on Circuits and Systems (ISCAS), Shanghai, China, May 24-27, 2026.
IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems (TCAD), 2025.