ULTRA-2.5D: An Analytical Placement Framework for Ultra-Large-Scale Multi-Reticle Chiplet Systems
IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems (TCAD), 2026.
- † 通讯作者
博士生
CODA lab · 复旦大学
2025年秋季加入课题组
近期研究包括时序驱动全局布线与电源网络建模。
IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems (TCAD), 2026.
IEEE/ACM International Conference on Computer-Aided Design (ICCAD), San Jose, CA, USA, Nov. 8-12, 2026.
IEEE International Symposium on Circuits and Systems (ISCAS), Shanghai, China, May 24-27, 2026.