ULTRA-2.5D: An Analytical Placement Framework for Ultra-Large-Scale Multi-Reticle Chiplet Systems
IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems (TCAD), 2026.
- † 通讯作者
工程博士生
CODA lab · 复旦大学
2025年秋季加入课题组
研究 2.5D 芯粒系统的电源网络优化与物理设计。
主要导师:Changhao Yan(严昌浩)教授
IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems (TCAD), 2026.
IEEE/ACM International Conference on Computer-Aided Design (ICCAD), San Jose, CA, USA, Nov. 8-12, 2026.