ULTRA-2.5D: An Analytical Placement Framework for Ultra-Large-Scale Multi-Reticle Chiplet Systems
IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems (TCAD), 2026.
- † 通讯作者
Jinhong Huang（黄锦鸿）
博士生
CODA lab · 复旦大学
2024年秋季加入课题组
近期研究包括芯粒布局与电源网络的神经网络寄生参数建模。
与Xuan Zeng（曾璇）教授联合指导
教育经历
- 本科，福州大学
论文
Analytical Chiplet Placement with Force-Directed Guidance and Chiplet Bridging for Multi-Reticle Interposers
IEEE/ACM International Conference on Computer-Aided Design (ICCAD), San Jose, CA, USA, Nov. 8-12, 2026.
- † 通讯作者
- 已录用
CNE-PDN: Joint Optimization of PDN Geometry and TSV Layout via Component-Level Neural Parasitic Extraction for 2.5D IC
IEEE/ACM International Conference on Computer-Aided Design (ICCAD), San Jose, CA, USA, Nov. 8-12, 2026.
- † 通讯作者
- 已录用