ULTRA-2.5D: An Analytical Placement Framework for Ultra-Large-Scale Multi-Reticle Chiplet Systems
IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems (TCAD), 2026.
- † Corresponding authors
Chengkai Zhu
Doctor of Engineering student
CODA lab · Fudan University
With the group since Fall 2025
Works on power-delivery-network optimization and physical design for 2.5D chiplet systems.
Primary advisor: Prof. Changhao Yan
Education
- Doctor of Engineering studies, Fudan University, 2025–present
- Bachelor’s degree, Nanjing University of Posts and Telecommunications
Projects
- CNE-PDN — Joint optimization of power-delivery-network geometry and TSV layout for 2.5D ICs.
Publications
CNE-PDN: Joint Optimization of PDN Geometry and TSV Layout via Component-Level Neural Parasitic Extraction for 2.5D IC
IEEE/ACM International Conference on Computer-Aided Design (ICCAD), San Jose, CA, USA, Nov. 8-12, 2026.
- † Corresponding authors
- Accepted