ULTRA-2.5D: An Analytical Placement Framework for Ultra-Large-Scale Multi-Reticle Chiplet Systems
IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems (TCAD), 2026.
- † Corresponding authors
Ph.D. student
CODA lab · Fudan University
With the group since Fall 2024
Recent work includes chiplet placement and neural parasitic modeling for power-delivery networks.
With Prof. Xuan Zeng
IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems (TCAD), 2026.
IEEE/ACM International Conference on Computer-Aided Design (ICCAD), San Jose, CA, USA, Nov. 8-12, 2026.
IEEE/ACM International Conference on Computer-Aided Design (ICCAD), San Jose, CA, USA, Nov. 8-12, 2026.