ULTRA-2.5D: An Analytical Placement Framework for Ultra-Large-Scale Multi-Reticle Chiplet Systems
IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems (TCAD), 2026.
- † Corresponding authors
Ph.D. student
CODA lab · Fudan University
With the group since Fall 2025
Recent work includes timing-driven global routing and power-delivery-network modeling.
IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems (TCAD), 2026.
IEEE/ACM International Conference on Computer-Aided Design (ICCAD), San Jose, CA, USA, Nov. 8-12, 2026.
IEEE International Symposium on Circuits and Systems (ISCAS), Shanghai, China, May 24-27, 2026.